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PECVD Carbon System
Model:
Manufacturer:J&L Co.,Ltd. Korea

Person in Charge:Rende Chen
Tel:+86-574-86685036

Main Parameters:
△Plasma source: ARC, PECVD,ALD
△Base Pressure:<1.0×10-5Torr
△Chamber size:Φ500×300mm
△Substrate bias: 0~650V,5~350kHz

Applications:
The system can be used to deposit various functional coatings and the surface modification
of plasma treatment. The substrates include metal, alloy, polymer, ceramic, fiber and so on.


PECVD System
Model: 
Manufacturer:SKY Co.,Ltd. China

Person in Charge:Rende Chen
Tel:+86-574-86685036

Main Parameters:
△Plasma source:magnetron sputtering, PECVD
△Base Pressure:<1.0×10-5Torr
△Chamber size:Φ350×300mm
△Substrate bias:DC (  ~200V),RF (13.56MHz, 3.6KW),

Applications:
The system can be used to deposit various functional coatings and the surface modification
 of plasma treatment. The substrates include metal, alloy, polymer, ceramic, fiber and so on.


ARC System
Model:
Manufacturer:NIMTE, China and J&L, Korea

Person in Charge:Dr. Zhengyu Wang 
Tel:+86-574-86685036

Main Parameters:
△Plasma source: linear and end-hall ion beam, metal arc, HIPIMS sputtering
△Base pressure:<1.0×10-5Torr
△Chamber size:Φ700×650mm
△Substrate turntable:6 axels with revolution and rotation (Speed :0~30rpm)
△Substrate bias:pulse( 2~100KHZ, ~1200V),

Applications:
This system is specially designed to deposit the functional nano-structured coatings with high
performance like ta-C, CrN, TiN, TiAlN, metal alloy thin films etc. on the various substrates.

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